SikaBond®-52 Parquet

SikaBond®-52 Parquet is a 1-component, solvent-free, wood flooring adhesive for professional use. Ideal for bonding wood floors using liquid batten/beaded applications due to its good initial tack and low sag flow. Use with solid, engineered, parquet wood floors and chipboard.

Recommended uses

For the Sika® AcouBond®-System: Solid wood boards (tongued and grooved), 3-ply engineered wood, chipboard, plywood and herringbone blocks can all be bonded. For detailed application instructions refer to the Product Data Sheet of the Sika® AcouBond®-System, or contact our Technical Department For Beaded Application: Solid wood boards, 3-ply engineered wood can be bonded Subfloor types: Concrete (at least 28 days old) over Sikascreed®-40 T&G Exterior Grade Plywood T&G Sturd-I-Floor® Oriented strand board (OSB) Properly prepared existing terrazzo floors Properly prepared existing ceramic tiles Underlayments: Sikalevel®-115 Skim Coat SIkalevel®-125

Features

• 1-component, ready to use
• Fast curing properties Floor can be sanded after 12 hours (full surface bonding, +23°C / 50% r. h., up to 1 mm adhesive thickness)
• Excellent workability, very easy to extrude.
• Good initial tack
• Elastic, footfall sound-dampening adhesive when used in combination with Sika® Layer-03 (as part of Sika® AcouBond® System)
• Suitable for most common types of wood floors. Especially suitable for problematic woods including beech, maple and bamboo
• Suitable for bonding wood floors directly onto old ceramic tiles
• Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate
• Compensates for some substrate unevenness.
• Adhesive can be sanded
• Solvent free

Packaging

600 ml foil pack (20 US fl. oz) 20 foil packs per box 1800 ml foil pack (60 US fl. oz) 6 foil packs per box

ENVIRONMENTAL INFORMATION

LEED® EQc 4.1 SCAQMD, Rule 1168 BAAQMD, Reg. 8, Rule 51

Composition / Manufacturing

Polyurethane I-Cure technology

Shelf Life

12 months from date of production

Storage Conditions

The product must be stored in original, unopened and undamaged sealed packaging in dry conditions at temperatures between 5 °C and 25 °C. Always refer to packaging.

Density

Approximately 1.30 kg/l (ISO 1183-1)

Shore A Hardness

Approximately 35 (after 28 days) (ISO 868)

Tensile Strength

Approximately 1.4 MPa (ISO 37)

Shear Strength

Approximately 1.1 MPa (1 mm adhesive thickness) (ISO 17178)

Service Temperature

Minimum 5 °C / maximum 40 °C

Sag Flow

Spreads easily while maintaining stable trowel peaks.  Flows well from SikaBond® Dispensers or application guns while maintaining stable peaks.

Ambient Air Temperature

+15 °C min. / +35 °C max. (59 °F min. / 95 °F max.)

Relative Air Humidity

40 %–70 %

Substrate Temperature

+15 °C min. / +35 °C max. (59 °F min. / 95 °F max.) (+20 °C min. / +35 °C max (68 °F min. / 95 °F max.) with underfloor heating). Temperatures must be maintained during application and until fully cured.

Curing Rate

~3.5 mm / 24 hours (+23 °C / 50 % r.h.) (CQP* 019-1) *Sika Corporate Quality Procedure

Skin Time / Laying Time

~60 minutes (+23 °C / 50 % r.h.) (CQP 019-1)

Consumption

Sika® AcouBond®-System ~400–500 ml/m 2 for SikaLayer®-03 . All cut-outs must be filled. Use a triangular nozzle with an 8 mm × 10 mm opening. Beaded bonding - Application gun ~250–500 g/m 2 (44 ml per running metre), depending on bead spacing (solid wood boards, 3-ply engineered wood, chipboards). When bonding long or wide boards or applying on uneven substrates, a sufficient amount of adhesive must be applied to provide full surface bonding. Consumption depends on the roughness and absorbency of the substrate. These figures are theoretical and do not allow for any additional material due to surface porosity, surface profile, variations in level or wastage etc.

SUBSTRATE PREPARATION

General Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond. All substrates must be structurally sound, clean, dry, smooth, free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants or any contaminants or conditions that may affect adhesion or overall product performances. Remove laitance or weak areas mechanically. Surfaces should be thoroughly cleaned with an industrial vacuum scrubbing the surface with a brush attachment. Surfaces shall be flat, plumb and true with a maximum permissible variation of 4.5 mm in 3.05 m (3/16 in. in 10 feet) or more than 2 mm in 600 mm (5/64 in. in 2 feet) from the required plane. SikaBond®-52 Parquet may be used over all properly prepared substrates common to hardwood flooring installations including cured concrete, exterior grade T&G plywood, T&G OSB subfloor Rated Sturd-I-Floor(offering a minimum 200-day no-sand warranty), well bonded and properly prepared existing sound ceramic tile, SikaLevel-115 Skim Coat and SikaLevel underlayments and properly prepared sound and solid terrazzo.

MIXING

1-part ready to use

CLEAN UP

SikaBond®-52 Parquet is extremely difficult to remove when cured. Immediately clean any adhesive from tools with Sika ® Cleaning Wipes -120 before the adhesive cures.