SikaBond®-T35

SikaBond®-T35 is a one-component, low-VOC, low odour, moisture-cured polyurethane adhesive for full surface bonding of wood flooring. SikaBond®-T35 will tenaciously bond wood to most surfaces, including concrete, plywood, and levelling and patch underlayments that have been properly prepared.

Recommended uses

SikaBond®-T35 may be used to bond all engineered, solid plank flat milled, shorts up to max. 19 mm (3⁄4”) thick, including bamboo, cork and parquet hardwood flooring designed by the manufacturer for glue down applications. This adhesive can also be used for many other bonding applications that are common for light commercial and residential applications including acoustic rubber underlayment systems.

Features

• 170% Elongation
• Easy to trowel
• Fast curing
• Excellent workability, holds ridges after troweling
• Suitable for common types of wood floors
• Tenacious bond
• Suitable for in-floor radiant heat installation
• Low odour
• Contains no water

Packaging

18.93 L (5 US gal.) unit

Composition / Manufacturing

One-component polyurethane, moisture curing

Shelf Life

12 months from date of production

Storage Conditions

Stored in undamaged original sealed containers, in dry conditions and protected from direct sunlight at temperatures between +10°C – 25°C (50°F and 77°F).

Density

1.18 kg/L (9.85 lbs/US gal )

Volatile organic compound (VOC) content

53 g/L

Shore A Hardness

~ 50 (after 28 days)

Tensile Strength

1.05 MPa (150 psi) at 23°C (73 °F) and 50% r.h.

Shear Strength

1.05 MPa (150 psi) using 1 mm adhesive thickness at 23 °C (73 °F) and 50% r.h.

Service Temperature

-40 °C – +70 °C (-40 °F – +158 °F)

Sag Flow

Consistency: Spreads easily, holds ridges after troweling

Ambient Air Temperature

Room temperature between +15 °C (60 °F) and +35 °C (90 °F). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Relative Air Humidity

Between 40% and 70% during installation is best for adhesive. See wood floor manufacturer for wood requirements.

Substrate Temperature

During laying and until SikaBond®-T35 has fully cured, substrate temperature should be greater than +15 °C (60 °F) and in case of radiant heating, less than +20 °C (70 °F). For substrate temperatures, the standard construction rules are relevant.

Substrate Moisture Content

Moisture requirements are set forth to protect the wood flooring products that can expand and contract with different moisture levels. SikaBond®-T35 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not accep able, use Sika® MB. See Sika® MB technical data sheet for proper instruction on Sika® MB.

Curing Rate

4.0 mm/24 hrs. at 23 °C (73 °F) and 50% r.h. Floor may accept light foot traffic after 6-8 hrs. (depending on climatic conditions and adhesive layer thickness).

Skin Time / Laying Time

~ 45 – 60 minutes at 23 °C (73 °F) and 50% r.h.

Consumption

Engineered wood flooring: P5 Trowel: approximately 4.18 m 2 – 4.65 m 2 (45 – 50 SF/ US gal) Short hardwood solids including bamboo shorts max. 19 mm (3⁄4 ") thick: 6 mm x 6 mm x 6 mm (1⁄4 x 1⁄4 x 1⁄4 inch ) square notch trowel) approximately 2.79 m 2 – 3,72 m 2 (30-40 SF/ US gal) Coverage mus  be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage. Trowel size is recommended to obtain proper coverage. Larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing. Check coverage during installation. Trowels should be used at the 90° angle to subfloor to get stated coverages. Periodically check trowel for wear. Worn trowels must be replaced immediately.

APPLICATION INSTRUCTIONS

Substrate Quality Substrate must be clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.

CLEAN UP

All tools should be cleaned immediately after use with Sika® Urethane Cleaner and Thinner. Any adhesive that is permitted to cure on the tools will need to be removed by mechanical means. Use a dry cloth or Sika® Hand Cleaner towels to remove adhesive from pre-finished wood surfaces before it cures. Finger prints or small amounts of adhesive residue can be removed from pre-finished wood using the Sika® Hand Cleaner towels. Sika® Hand Cleaner towels use a citrus based cleanser that will not harm the floor finish.

Cure time

4.0 mm/24 hrs. at 23 °C (73 °F) and 50% r.h. Floor may accept light foot traffic after 6-8 hrs. (depending on climatic conditions and adhesive layer thickness).

Application temperature

Room temperature between +15 °C (60 °F) and +35 °C (90 °F). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

VOC

53 g/L